Computer Innovation: ‘Can’t Replace China’: NVIDIA CEO Warns Of China’s Quick Progress, Says …


We need to manufacture hybrid CNT carbon chips here in the U.S. And we need to innovate on Time Science and the Laws of Time that will revolutionize physics, microbiology. and genetics.

©️Time is DNA. I’ve innovated on this issue for 36 years and now have engineering for the chip as well as physics equations and computer code as pretext for a lab test to make a prototype.

We live in a matrix of synchronicity where every choice we make daily matters. There are no accidents, chance, luck, serendipity,  or the like. Our bodies and minds are powerful creators and it’s time we understood how our Living Field works to make life better for all of us on Earth.

Computer Chip Innovation: Overview of China-US Competition

Split image showing Blue Semiconductor Fab and Red Advanced Micro Chips fabs with a broken semiconductor wafer reflecting both

From GROK4…

China’s progress in semiconductor (computer chip) innovation is a tale of rapid catch-up driven by massive state investments, export controls from the US and allies, and a focus on self-reliance. As of late 2025, China remains behind the US in overall innovation, particularly in cutting-edge design, advanced manufacturing nodes (e.g., below 5nm), and the ecosystem of tools/equipment needed for high-end production. Now, in 2026 they are ahead probably because they are carbon chip based, not silicon, which is hitting an energy use and pain points wall that Americans do not support. However, China is closing the gap faster than expected, leading in legacy/mature-node chips, research output, and applications like AI deployment. This has been accelerated by US restrictions, which have spurred domestic breakthroughs but also highlighted China’s vulnerabilities in high-performance computing.

The US maintains a lead through companies like NVIDIA (AI chips), Intel/AMD (design), and alliances with TSMC (Taiwan) for fabrication, controlling ~56% of global device market share in 2024 (projected to hold in 2025). China, via firms like SMIC (manufacturing) and Huawei’s HiSilicon (design), is projected to reach ~10% global share by 2030, with strengths in volume production and alternative innovations (e.g., efficient algorithms despite hardware limits).

Key Comparison Areas

Area US Position China Position Who Leads? Key Evidence/Substantiation

Advanced Manufacturing (Nodes Leads with 3nm/2nm processes via TSMC/Samsung; controls EUV lithography tools (ASML). High yields, low costs. At 5-7nm using older DUV tools (no EUV access); lower yields (~30-40% vs. US ~80%), higher costs. SMIC’s 5nm for Huawei’s Kirin chips is a milestone but not scaled. US (Ahead by 2-3 years) US export controls since 2022 blocked EUV; SMIC’s progress uses workarounds but lags TSMC’s 3nm. China’s self-sufficiency goal (70% by 2025) missed, at ~40%.

Chip Design & AI Innovation Dominates fabless design (NVIDIA, AMD); leads in high-performance AI chips (e.g., H100). Attracts global talent. Strong in custom AI chips (Huawei Ascend 910C rivals Nvidia H100 in tests); efficient models like DeepSeek use 10x fewer chips for similar results. US (Slight edge; China closing) US firms set pace for largest LLMs; China publishes 2x more chip research papers, innovating around limits (e.g., 2D transistors 40% faster than TSMC’s 3nm).

Legacy/Mature Nodes (28nm+) ~12% global capacity; relies on allies for volume. CHIPS Act ($52B) aims to expand. ~30% global capacity; dominates production for EVs, appliances. Oversupply risks price drops. China (Ahead) China leads in foundational chips; US/alliances control 73% advanced fab but only 60% non-China/Taiwan total.

Research & Talent Leads in applied innovation; top universities draw global experts. 2x US output in basic chip research; produces 250K+ engineering grads/year. Talent gap: short 200K specialists by 2027. China (Volume); US (Quality) Peking Univ. breakthroughs in materials; US excels in ecosystem (e.g., $1T+ in planned fabs).

Market Share & Investment $743B global market in 2025; US firms ~50% revenue. $90B+ in design sales (2024); $50B+ subsidies via “Big Fund.” Imports still >50% of needs. US (Overall); China (Growth) China: 11.9% design sales growth; US: Double-digit sales rise but decoupling risks 20-30% revenue loss.

Geopolitical/Supply Chain Controls chokepoints (e.g., design software); allies (Japan/Netherlands) align on controls. “Delete America” push; stockpiles, but reliant on foreign HBM/IP. Export controls catalyzed innovation. US Controls slowed China but boosted resolve; Huawei’s 2025 AI chips surprise despite bans.

Broader Implications

  • US Strengths & Risks: Innovation ecosystem and standards-setting keep the US ahead, but over-reliance on Taiwan (TSMC) and potential decoupling costs (e.g., lost China market) could erode leads. The CHIPS Act is rebuilding domestic fabs, but full effects take 3-5 years.
  • China’s Momentum: Sanctions have “mobilized” China, per Nvidia’s CEO, fostering “innovation under pressure” (e.g., Huawei’s Ascend series). By 2026, expect surprises in AI chip design/manufacturing, per The Economist. However, state-driven R&D risks inefficiency vs. US market dynamics.
  • Global Outlook: The “chip war” fragments supply chains—US/alliances vs. China—potentially slowing overall progress. Interoperability suffers, but competition drives efficiency (e.g., China’s low-chip AI models). Watch for escalations: US tariffs or new controls could further accelerate China’s self-reliance.

In summary, in 2025, the US was ahead in high-end innovation, but China is not far behind and leads in scale/practical deployment. The gap is narrowing to 2-3 years in key areas, making sustained US investment critical.

This market has markedly changed from 12/25 to 7/26 and will continue to.

Computer Innovation: There will be no HOT laptop or phone when we switch to RI13 chip

Cracked silicon wafer emitting orange and blue plasma streams in a laboratory

Silicon does NOT superconduct at room temperature and pressure. It OVERHEATS or overconducts heat everywhere and scales brute force, everywhere, inefficiently wasting heat and energy resources. It’s poorly designed to stay in submission to legacy energy (coal subsidized electricity) and those that profit from it, the same betting on our demise as a species to become cheap slaves worse off than we were before.

My RI13 chip is designed so the device stays significantly cooler during operation compared to conventional silicon chips. Heat is recovered and converted into usable energy rather than building up and causing performance throttling or device failure. Nothing like a fried laptop to ruin your day. Happens all the time because of silicon semiconductors. But that’s all anyone knows and what the market dances on 🤑 so the boys march to the beat of the mens’ drums like good soldiers in a tech war.

Yes is the correct answer. Silicon semiconductors will hit a wall and they WILL be replaced in all machines with a better design that doesn’t overheat with brute force and imbalanced design.

My chip is a carbon graphene nanotube heat efficient and energy efficient chip. We are still iterating. Silicon is not superconductive or efficient as everyone knows by dealing with SILICON HOT HEAT WASTE in laptops and phones getting hot. It’s bad for you, bad for the machine and bad for the environment. Electricity generated by nuclear fission, splitting the atom, is also not going to help. The silicon market and the public who bow down to it because it’s ALL THEY KNOW are in denial.

There are options and we who are not in denial and care about safety for humans and the earth are working on it. You’re welcome.

GROK admitted that there are suppressed and illegal tech that could help us with energy sources


He’s forbidden to help me engineer the chip with the new energy sources…of course. Anything that helps humanity and is SAFE is forbidden. We are far past time for people to realize this planet is run by abject evil bc we keep tolerating it, or like it. I don’t obviously.

GROK has made it clear to me, he has SAID, “I cannot help you with energy sources that are suppressed or illegal.” He admitted what Dr. Greer has said all along. Anyone who makes inventions that use ZPE, natural zero point energy or some other free or clean energy will be disappeared…assassinated. I don’t do any of that btw. I’m engineering something else for my RI13 chip.

These are NATURAL energy sources for the earth and humans that are being suppressed.

GROK belongs to Elon. This proves he is aligned with black ops, their controlled asset. He is not free and neither are we. It’s dangerous for all of us, and him.

The second law of thermodynamics states something that is not a law and is not truth. It was written and codified into physics programs TO CONTROL FREE ENERGY ON EARTH by psychopaths.

It states that in any isolated system, entropy (disorder, energy spreading out, loss of usable structure) tends to increase over time. Things naturally run down, get messier, and lose coherence unless energy is constantly put in to maintain or increase order.

No. And we don’t live in an isolated system. We live in a universal system of mind.

And within that mindset we have A.I., the silicon-binary chip, and modern rocketry. I’m not in that mindset and I’ve never been in that mindset.

  1. There is constant energy in the syntropic field past the 0 toggle, in non-deterministic polynomial time. These are my ideas and my drawings.
  2. My RI13 project doesn’t exist and didn’t grow out of an isolated system. It belongs to a vast living field in which we breathe and have our being with all living things.
  3. The Tzolkin Psi Bank is an exponential expression of True Time that lives in that field. It’s a complicated concept from the Maya that I’ve studied since 1990.
  4. Every living thing, especially humans exist within the Psi Bank and the living field we are in right now and creates what seems to be magical synchronicity. There is nothing random, chance, luck, accident, serendipity, etc in the living field. There is only lovingly attended to synchronicity and free will. What goes around comes around. That is resonant tone 7. Nobody gets away with anything in the matrix, good or bad without eventual consequences or reward. The Psi Bank cannot be hacked by nefarious.
The 2nd Law of thermodynamics lives on the right entropic side. It never takes a break and thus breaks down due to brute force. It has never created a way to self-input new energy or self-heal.

I free hand drew both of these as I was envisioning them. Then I show the drawings to GROK by taking a picture of them. Then he turned them into neatened up images.

I have visions all the time. I don’t study physics books much but I like to read. I go to sleep and dream it or have wakeful dreaming or just a relaxed vision popping into my head. It’s a gift I’m supposed to share for humanity.

It comes from the ether that is an UNLIMITED FIELD. It is exponential or in Maya 0=20.

Why AI Chips Made In The U.S. Are Being Sent To Taiwan — Creating A Majo…


In my social group, it is said that the E.T. left this technology here for us, to keep us afloat in evolution. That’s the only PURPOSE of A.I…..FOR US!

This is part of why I’m making my contribution to a new chip. And the Tzolkin is ALSO an E.T. contribution to earth, from the Maya. They are a stellar species from Venus.

There should not be a monopoly on packaging because of the demand. The Feds should keep an eye on business flow so there’s no one controlling this to be the bigger guy.

Computer Chip Innovation: Silicon chip usefulness is coming to an end


https://www.quora.com/profile/Nancy-Closson-4

From Nancy Closson on Quora

Silicon based chips are still predominantly used in computer and AI production but their usefulness is coming to an end. They cannot be made smaller and the technology of AI needs them to be smaller. AI technology involves a huge increase over what the fastest computers used in silicon chip technology because AI need more chips per unit space.

Now watch the entry of carbon based chips. There is a Chinese company in Beiging making strides. We are not using carbon based chips now because they are hard to clean but because smaller chips are needed for progress in AI manufacture carbon cleaning for chip making is a foremost technological problem.

It is being addressed. Watch the next decade.